Lead frame having a perimeter recess within periphery of component terminal

ABSTRACT

Embodiments described herein relate to manufacturing a device. The method includes etching at least one recess pattern in an internal surface of a lead frame, the at least one recess pattern including a perimeter recess that defines a perimeter of a mounting area. The method also includes attaching a component to the internal surface of the lead frame such that a single terminal of the component is attached in the mounting area and the single terminal covers the perimeter recess, wherein the perimeter recess has a size and shape such that the recess is proximate a perimeter of the single terminal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a cross-sectional view of an embodiment of a packaged circuitincluding a lead frame having a perimeter recess within the periphery ofa component terminal.

FIG. 1B is an enlarged cross-sectional view of the packaged circuit ofFIG. 1A.

FIG. 2 is a plan view of an embodiment of the packaged circuit of FIGS.1A and 1B.

FIG. 3A is an enlarged cross-sectional view of an embodiment of aportion of the lead frame of the packaged circuit in FIGS. 1A and 1B.

FIG. 3B is an enlarged cross-sectional view of another embodiment of aportion of the lead frame of the packaged circuit in FIGS. 1A and 1B.

FIG. 4A is a top view of an embodiment of a lead frame having aperimeter recess within the periphery of a component terminal.

FIG. 4B is a perspective view of the lead frame of FIG. 4A.

FIG. 5A is a top view of another embodiment of a lead frame having aperimeter recess within the periphery of a component terminal.

FIG. 5B is a perspective view of the lead frame of FIG. 5A.

FIG. 6A is a top view of yet another embodiment of a lead frame having aperimeter recess within the periphery of a component terminal.

FIG. 6B is a perspective view of the lead frame of FIG. 6A.

FIG. 7A is a top view of still another embodiment of a lead frame havinga perimeter recess within the periphery of a component terminal.

FIG. 7B is a perspective view of the lead frame of FIG. 7A.

FIG. 8A is a top view of another embodiment of a lead frame having aperimeter recess within the periphery of a component terminal.

FIG. 8B is a perspective view of the lead frame of FIG. 8A.

FIG. 9 is a flow diagram of an example method of manufacturing apackaged circuit having a perimeter recess defined in a lead frame.

DETAILED DESCRIPTION

FIG. 1A is a cross-sectional view of an embodiment of a packaged circuit100 including a lead frame 102 having a perimeter recess 108 within theperiphery of a component terminal 104. The lead frame 102 is composed ofan electrically conductive material such as a metal. In an example, thelead frame 102 is composed of copper. The lead frame 102 comprises twoprimary surfaces: an external surface 103 and an internal surface 105.The external surface 103 is the surface that is on the outside of thepackaged circuit 100 (after the molding compound has been applied) andincludes a plurality of external terminals 107 for coupling the leadframe 102 (and therefore the packaged circuit 100) to external circuits(e.g., a printed circuit board). The internal surface 105 includes oneor more pads for mounting of a component 116 and any other active orpassive components.

The component 116 is mounted to the internal surface 105 of the leadframe 102. Although the example shown in FIG. 1A illustrates a singlecomponent 116, in other examples, additional active or passivecomponents can be mounted to the lead frame 102. In an example, thepackaged circuit 100 includes multiple components in a multichip packagesuch as, for example, to implement a power conversion system. The powerconversion system can include a power stage as well as a controllerand/or driver for the power stage. For example, the component 116 can beencapsulated or non-encapsulated and can include one or more of a highside FET, low side FET, a diode (e.g., Schottky diode), or adriver/controller. Other components such as an inductor or passive diecan also be mounted on the lead frame 102. In an example, the powerconversion system can comprise one or more of the following: a DC-to-DCpower converter, a charger, a hot-swap controller, an AC-DC converter, abridge driver, a buck converter, a boost converter, a buck-boostconverter, a synchronous buck converter, or a portion of any of thesecircuits. In another example, the packaged circuit 100 includes a singledie in a single-chip package such as, for example, to implement adiscrete device.

The component 116 includes a terminal 104 on a bottom side thereof formounting to the internal surface 105 of the lead frame. The terminal 104can be configured for electrical and/or thermal coupling between thelead frame 102 and the component 116. Accordingly, the terminal 104comprises a conductive pad on the component 116, which is typicallysurrounded by non-conductive material. The component 116 can alsoinclude other terminals. For pedagogical purposes, only a singleterminal 104 of the component 116 is shown, however, it should beunderstood that the component 116 can have more than one terminal.

A component attach adhesive 106 can be disposed between the terminal 104and the internal surface 105 of the lead frame 102 to mechanicallyattach and electrically and/or thermally couple the terminal 104 to thelead frame 102. The component attach adhesive 106 can comprise solder ora conductive or insulating epoxy.

The example lead frame 102 shown in FIGS. 1A, 1B, and 2 includes arecess pattern consisting of a perimeter recess 108. For the purposes ofthis specification, the term recess pattern refers to any recess formedin the internal surface 105 of a lead frame 102 within the periphery ofa terminal 104 of a component 104. In the example shown in FIG. 1A, therecess pattern consists of a perimeter recess 108; however, in otherexamples, the recess pattern can include other recesses within theperiphery of a terminal 104, such as shown in FIGS. 5A-8B.

Referring back to FIG. 1A, the perimeter recess 108 comprises a recessedportion (e.g., a trench) in the internal surface 108 of the lead frame102. Additionally, the perimeter recess 108 has a shape that encloses anarea. The area that is enclosed by the perimeter recess 108 on theinternal surface 105 of the lead frame 102 is referred to herein as themounting area 202 and is illustrated in FIG. 2, which shows a top viewof the packaged circuit 100. In the example shown in FIG. 2, theperimeter recess 108 has a shape comprising a perimeter of a rectangle(e.g., a square). The mounting area 202, therefore, has a generallyrectangular shape as well. In other example, the perimeter recess 108can have other shapes such as a circle or other polygon. As compared tothe perimeter recess 108, the example mounting area 202 of FIG. 2comprises a raised surface. The terminal 104 of the component 116 ismounted to this raised surface in the mounting area 202. Accordingly,the component attach adhesive 106 is disposed on the raised surface inthe mounting area 202 between the terminal 104 and the lead frame 102.

FIG. 1B is an enlarged view of a portion of the packaged circuit 100. Asshown, during second level reflow events after manufacture of thepackaged circuit 100, the component attach adhesive 106 can soften andexpand from the mounting area 202. Such second level reflow eventsinclude when the packaged circuit 100 is mounted to a printed circuitboard or the like. During these second level reflow events, the recesspattern, including the perimeter recess 108 provides space into whichthe component attach adhesive 106 can expand, without leaking out of thepackage. Moreover, as a recess, the perimeter recess 108 providesmultiple breaking features including an outer wall surface that impedesthe flow of component attach adhesive 106. Thus, as the component attachadhesive 106 expands during a reflow event, the perimeter recess 108helps contain the component attach adhesive within the periphery of theterminal 104, and therefore, helps reduce or eliminate leakage of thecomponent attach adhesive 106 to the outside of the package. Typically,the recess pattern is used on large terminals having large amounts ofcomponent attach adhesive 106. The perimeter recess 108 provides spacefor the component attach adhesive 106 and impedes the flow of thecomponent attach adhesive 106 on all (e.g., four) sides of the terminal104.

Notably, the perimeter recess 108 is within the periphery 204 of theterminal 104. That is, when the component 116 is mounted in the mountingarea 202, the perimeter 204 of the terminal 104 is larger (i.e., outsideof) the outer edge of the perimeter recess 108 and conversely theperimeter recess 108 is underneath and inside of the perimeter 204 ofthe terminal 104. This is advantageous in that the perimeter recess 108can be included without using area on the internal surface of the leadframe 102 outward from the terminal 104, enabling such area outward fromthe terminal 104 to be used for other purposes, such as lead framelocking features. Additionally, this enables the internal surface 105 tobe the same size as the periphery 204 of the component 116 while stillimpeding the flow of component attach adhesive 106. In an example, theouter shape of the perimeter recess 108 on the internal surface 105 isconfigured to match the shape of the terminal 104 such that when theterminal 104 is mounted in the mounting area 202, the perimeter recess108 is proximate the perimeter 204 of the terminal 104. Thus, thecomponent attach adhesive 106 used for the terminal 104 is disposed inthe mounting area 202 (i.e., internal to the perimeter recess 108) andthe perimeter recess 108 provides perimeter containment for thecomponent attach adhesive 106 during first level solder reflow. Theterminal 104 is a single terminal and, in some examples, the terminal104 is coupled to the lead frame 102 only in the mounting area 202. Thatis, the terminal 104 is not coupled to the lead frame 102 outside of theperimeter recess 108. In addition, in some examples other terminals orinterconnect mechanisms (from the same or other components) are notcoupled in the mounting area 202. In examples having other terminals,components, and/or interconnect mechanisms attached to the internalsurface 105, such other terminals, components, and/or interconnectmechanisms are attached to the internal surface 105 in areas other than(i.e., outside of) the mounting area 202.

A top surface of the component 116 can be coupled to the internalsurface 105 of the lead frame 102 by one or more wire bonds 118, copperclip(s), aluminum ribbon(s), or other interconnect mechanism. The wirebonds 118 can be attached to the internal surface 105 of the lead frame102 and to the top surface of the component 116. Molding compound 122can surround the component 116 and extend partially around the leadframe 102. The molding compound 122 can comprise any suitable moldingcompound such as a thermoset, thermoset epoxy, or thermoplastic.

In an example, the lead frame 102 is composed of a plurality of distinctand generally planar sections of conductive material, where the sectionsare oriented such that the sections collectively have a generally planarconfiguration. In an example, one or more of the sections of conductivematerial can be floating, that is, one or more sections of conductivematerial do not abut an edge (perimeter) of the package of the packagedcircuit 100. In such examples, the packaged circuit 100 can includesolder resist 110 on a bottom edge thereof in between sections of thelead frame 102. The solder resist 110 can be composed of an electricallynon-conductive solder mask material (resist), including both organic andnon-organic solder mask material.

FIG. 3A is an enlarged cross-sectional view of a portion of the leadframe 102 showing the perimeter recess 108. In this example, the surfaceof the perimeter recess 108 is exposed lead frame (e.g., copper). FIG.3B is an enlarged cross-sectional view of a portion of another examplelead frame 302 having a perimeter recess 308. In this example, theperimeter recess 308 is coated with a non-conductive material 304, suchas a solder mask material (resist) which can include both organic andnon-organic solder mask material. Coating the surface of the perimeterrecess 308 with a non-conductive material 304 can reduce wetting of thecomponent attach adhesive 106 during reflow events and aid in allowingthe component attach adhesive 106 to retreat back to its former positionafter a reflow event.

FIGS. 4A-8B illustrate different embodiments of a lead frame havingvarious recess patterns. FIGS. 4A and 4B illustrate the lead frame 102shown in FIGS. 1A, 1B, and 2. As shown, the lead frame 102 includes arecess pattern comprising a perimeter recess 108 that defines aperimeter around the mounting area 202. The perimeter recess 108 definesthe mounting area 202 as a single raised surface to which the terminal104 is mounted. The single raised surface of the mounting area 202 iscoated with a component attach adhesive for mounting of the terminal104. The perimeter 204 of the terminal 104 extends outward from theperimeter recess 108.

FIGS. 5A and 5B illustrate another example of a lead frame 502. The leadframe 502 includes a recess pattern including a perimeter recess 508 anda plurality of cross recesses 506. The perimeter recess 508 defines aperimeter around a plurality of raised surfaces 504 in the mountingarea. The plurality of raised surfaces 504 are defined by the perimeterrecess 508 and two cross-recesses 506 that extend across the mountingarea. Similar to the perimeter recess 508, the cross-recesses 506 arerecess in the internal surface of the lead frame 502. The cross-recesses506 are in the area enclosed by the perimeter recess 508, where theperimeter recess 508 comprises the outer loop portion of the recessesshown in FIGS. 5A and 5B. In this example, the cross-recesses 506 extendall the way across the area enclosed by the perimeter recess 508 suchthat they terminate at each end at the perimeter recess 508. In thisexample, the cross-recesses 506 extend perpendicular to one anotherforming a cross that results in four generally equally sized raisedsurfaces 504. The four raised surfaces 504 are coated with componentattach adhesive and the terminal 104 can be attached thereto. Theperimeter 510 of the terminal 104 extends outward from the perimeterrecess 508. Advantageously, the cross-recesses 506 provide additionalspace within the periphery of the terminal 104 into which the componentattach adhesive can expand during reflow events.

FIGS. 6A and 6B illustrate yet another example of a lead frame 602. Thelead frame 602 includes a recess pattern including a perimeter recess608 and a plurality of cross recesses 606. The perimeter recess 608defines a perimeter around a plurality of raised surfaces 604 in themounting area. The plurality of raised surfaces 604 are defined by theperimeter recess 608 and the four cross-recesses 606 that extend acrossthe mounting area. Similar to the perimeter recess 608, thecross-recesses 606 are recess in the internal surface of the lead frame602. The cross-recesses 606 are in the area enclosed by the perimeterrecess 608, where the perimeter recess 608 comprises the outer loopportion of the recesses shown in FIGS. 6A and 6B. In this example, thecross-recesses 606 extend all the way across the area enclosed by theperimeter recess 608 such that they terminate at each end at theperimeter recess 608. In this example, two cross-recesses 606 extendperpendicular to two other cross-recesses 606 forming a tick-tack-toeboard pattern that results in six generally equally sized raisedsurfaces 604. The six raised surfaces 604 are coated with componentattach adhesive and the terminal 104 can be attached thereto. Theperimeter 610 of the terminal 104 extends outward from the perimeterrecess 608. Advantageously, the cross-recesses 606 provide additionalspace within the periphery of the terminal 104 into which the componentattach adhesive can expand during reflow events.

FIGS. 7A and 7B illustrate still another example of a lead frame 702.The lead frame 702 includes a recess pattern including a perimeterrecess 708 and a plurality of cross recesses 706. The perimeter recess708 defines a perimeter around a plurality of raised surfaces 704 in themounting area. The plurality of raised surfaces 704 are defined by theperimeter recess 708 and two cross-recesses 706 that extend across themounting area. Similar to the perimeter recess 708, the cross-recesses706 are recess in the internal surface of the lead frame 702. Thecross-recesses 706 are in the area enclosed by the perimeter recess 708,where the perimeter recess 708 comprises the outer loop portion of therecesses shown in FIGS. 7A and 7B. In this example, the cross-recesses706 extend all the way across the area enclosed by the perimeter recess708 such that they terminate at each end at the perimeter recess 708. Inthis example, the two cross-recesses 706 extend parallel to one anotherresulting in three rectangular and equally sized raised surfaces 704.The three raised surfaces 704 are coated with component attach adhesiveand the terminal 104 can be attached thereto. The perimeter 710 of theterminal 104 extends outward from the perimeter recess 708.Advantageously, the cross-recesses 706 provide additional space withinthe periphery of the terminal 104 into which the component attachadhesive can expand during reflow events.

FIGS. 8A and 8B illustrate another example of a lead frame 802. The leadframe 802 includes a recess pattern including a perimeter recess 808 anda plurality of cross recesses 806. The perimeter recess 808 defines aperimeter around a single raised surface 804 in the mounting area. Theraised surface 804 is defined by the perimeter recess 808. The raisedsurface 804 includes a cross-recess portion 806 therein. Similar to theperimeter recess 808, the cross-recess 806 is a recess in the internalsurface of the lead frame 802. The cross-recess 806 is in the areaenclosed by the perimeter recess 808. In this example, the cross-recess806 does not connect with the perimeter recess 808, and instead definean island recess in the area enclosed by the perimeter recess 808. Suchan island recess can be air filled after the component 116 is mountedovertop. In this example, the cross-recess 806 is in the shape of across; however, other shapes can also be used. The raised surface 804 iscoated with component attach adhesive and the terminal 104 can beattached thereto. The perimeter 810 of the terminal 104 extends outwardfrom the perimeter recess 808. Advantageously, the cross-recess 806provide additional space within the periphery of the terminal 104 intowhich the component attach adhesive can expand during reflow events.

In an example, the clearance between the edge of a perimeter recess andthe edge of a lead frame or a section thereof is at least 0.10 mm. In anexample, a perimeter recess extends at least 0.063 mm below the internalsurface of the lead frame. In an example, the clearance between twoadjacent recesses (e.g., a perimeter recess and a cross-recess) is atleast 0.50 mm. In an example, a width of a recess (e.g., a perimeterrecess and a cross-recess) is at least 0.10 mm. Any of the aboverecesses (e.g., a perimeter recess and a cross-recess) can be filledwith molding compound, air, or partially filled with both afterencapsulation of the packaged circuit 100.

Manufacturing the circuit 100 into a package can include manufacturing aplurality of the packaged circuits 100 at the same time. For example, aplurality of lead frames 102 can be assembled adjacent to one another,each having appropriate components (116) mounted thereon. Onceassembled, the lead frames 102 and associated components can besingulated to form the individual packaged systems. The followingdescription refers to the process of forming a single packaged circuit100, but it should be understood that the process can involve forming aplurality of packaged circuits 100 at the same time.

FIG. 9 is a flow diagram of an example method 900 of manufacturing apackaged circuit having a lead frame 102 with a recess pattern includinga perimeter recess 108. The lead frame 102, the component 116, and anyother components to be mounted on the lead frame 102 are obtained (block902). The component 116 and any other components can include high sideFET, low side FET, a diode (e.g., Schottky diode), a driver/controller,an inductor, or a passive die as well as others. In examples includingone or more dies (e.g., a monolithic substrate), such one or more diescan be fabricated using appropriate semiconductor processes.

The lead frame 102 can be partially etched from the internal (top)surface 105 according to the desired recess pattern (block 904). Therecess pattern can include a perimeter recess 108 as well as anycross-recesses in the area enclosed by the perimeter recess 108. Thepartial etch extends only a portion of the way through the lead frame102 from the internal surface 105 toward the external (bottom) surface103. The partial etch results in a lead frame 102 having a recesspattern defined in the internal surface 105. To perform the partialetch, resist is placed on the internal surface 105 of the lead frame102, but resist is not placed on portions where the lead frame 102 is tobe removed with the etch. In an example, the partial etch extendsbetween 25 and 60% of the way through the lead frame 102. In exampleswhere the recess pattern includes a coating of non-conductive material,such non-conductive material can be applied to the recesses of therecess pattern. In other examples, the partial etch can extend in otherdistances. After the partial etch, plating can be deposited on theinternal surface 105 of the lead frame 102.

In some examples, the surfaces of the recess pattern can be coated withnon-conductive material 304 (block 905).

The internal surface 105 of the lead frame 102 can be coated with thesolder paste 106 using a solder mask and solder paint or a plurality ofsolder balls (block 906). This can include coating the raised surface(s)in the mounting area enclosed by the perimeter recess 108 with solderpaste.

The component 116 can be mounted on the solder paste 106 of the raisedsurfaces of the lead frame 102 (block 908). The component 116 can bealigned with and placed on the lead frame 102, for example, usingflip-chip mounting techniques. In particular, the component 116 can beplaced such that the terminal 104 covers the recess pattern and theperimeter 204 is disposed outward of the perimeter recess 108. Inexamples including other components, the other components can be mountedto the internal surface 105 of the lead frame 102 as well. In someexamples, the solder 106 can be reflowed once the component 116 and anyother components are in position on the lead frame 102.

In some examples, wire bond(s) 118, copper clip(s), aluminum ribbon(s),or other interconnect mechanism can be attached to the component 116,other components, and/or the lead frame 102 to achieve desired coupling(block 910). Once the component 116 and any other components have beenmounted and all appropriate electrical connections have been made,molding compound 122 can be flowed over the component 116, any othercomponents, and the lead frame 102 to encapsulate the component 116, anyother components, and the lead frame 102 (block 912). In a processforming a plurality of packaged circuits at the same time, moldingcompound 122 can be flowed over the plurality of assembled circuits.Once applied, the molding compound 122 can be cured or solidified.

A lead frame having a recess loop defined in an internal surface can beincluded in any appropriate package technology. For example, the leadframe can be included in a package having a single piece lead frame, orcan be included in a package where the lead frame is composed of aplurality of distinct and electrically isolated sections of conductivematerial.

In examples where the lead frame is composed of a plurality of sectionsof material, any of the sections can be etched to include a recess loopand any cross-recesses as desired (block 914). In such examples, theprocess of manufacturing the packaged circuit can include, in additionto the acts above, a partial etch of the internal surface 105 of thelead frame 102 along dividing lines, which correspond to the spacesbetween sections of the final lead frame 102. Once the molding compound122 is cured, the external surface 103 of the lead frame 102 can beetched at the dividing lines between future sections of the lead frame102. This partial etch extends a portion of the way through the leadframe from the external surface 103 toward the internal surface 105. Thepartial etch on the external surface 103 can be aligned with the partialetch on the internal surface 105 such that the combination of etchesdisconnect and electrically de-couple different sections of the leadframe 102 at the dividing lines.

In an example, an electrically non-conductive material, such as a soldermask material (e.g., resist) 110 can be applied to the external surface103 of the lead frame 102 (block 916). The solder mask material caninclude organic and non-organic solder mask material. Additionally,input/output land plating, solder, or the like can be applied to theexternal surface 103 of the lead frame 102.

When forming a plurality of packaged circuits at the same time, thecombined multiple packaged circuits can then be singulated to form aplurality of packaged circuits.

The directional references top and bottom stated and illustrated in thisapplication should not be taken as limiting. The directions top andbottom are merely illustrative and do not correspond to absoluteorientations. That is, a “top” or “bottom” surface refers merely to arelative orientation with respect to the lead frame and is not anabsolute direction. For example, in actual electronic applications, apackaged circuit may well be turned on its “side”, causing the “bottomsurface” described herein to face sidewise.

EXAMPLE EMBODIMENTS

Example 1 includes a method of manufacturing a device, the methodcomprising: etching at least one recess pattern in an internal surfaceof a lead frame, the at least one recess pattern including a perimeterrecess that defines a perimeter of a mounting area; and attaching acomponent to the internal surface of the lead frame such that a singleterminal of the component is attached in the mounting area and thesingle terminal covers the perimeter recess, wherein the perimeterrecess has a size and shape such that the recess is proximate aperimeter of the single terminal.

Example 2 includes the method of Example 1, wherein the single terminalof the component comprises an electrically conductive pad on thecomponent.

Example 3 includes the method of any of Examples 1 or 2, comprising:attaching one or more other components to the internal surface of thelead frame outside of the mounting area.

Example 4 includes the method of any of Examples 1-3, wherein theperimeter recess has a shape of a perimeter of a rectangle.

Example 5 includes the method of any of Examples 1-4, wherein themounting area comprises a single raised surface.

Example 6 includes the method of any of Examples 1-5, wherein etchingthe at least one recess pattern comprises etching one or morecross-recesses extending across the mounting area, thereby dividing themounting area into multiple raised surfaces.

Example 7 includes the method of any of Examples 1-6, wherein the one ormore cross-recesses terminate on each end by connecting with theperimeter recess.

Example 8 includes the method of any of Examples 1-7, comprising:placing component attach adhesive on one or more raised surfaces in themounting area; and applying molding compound on the lead frame andaround the component.

Example 9 includes a packaged circuit comprising: a lead frame includingat least one recess pattern on an internal surface thereof, the at leastone recess pattern including a perimeter recess that defines a perimeteraround one or more raised surfaces; a component having one or moreterminals, one of the terminals mounted to the one or more raisedsurfaces such that the terminal covers the perimeter recess, wherein theperimeter recess has a size and shape such that the recess is proximatea perimeter of the terminal; and component attach adhesive between thesingle terminal of the component and the one or more raised surfaces ofthe lead frame.

Example 10 includes the packaged circuit of Example 9, wherein theterminal of the component comprises an electrically conductive pad onthe component.

Example 11 includes the packaged circuit of Example 10, wherein theelectrically conductive pad is surrounding by non-conductive material.

Example 12 includes the packaged circuit of any of Example 9-11, whereinthe perimeter recess has a shape of a perimeter of a rectangle.

Example 13 includes the packaged circuit of any of Examples 9-12,wherein the one or more raised surfaces include a single raised surface.

Example 14 includes the packaged circuit of any of Examples 9-13,wherein the at least one recess pattern includes one or morecross-recesses internal to the perimeter recess, such that the one ormore raised surfaces include multiple raised surfaces.

Example 15 includes the packaged circuit of any of Examples 9-14,wherein the one or more cross-recesses terminate on each end byconnecting with the perimeter recess.

Example 16 includes the packaged circuit of any of Examples 9-15,comprising: component attach adhesive on the one or more raised surfacesbetween the lead frame and the component.

Example 17 includes a method of manufacturing a device, the methodcomprising: etching a recess pattern in an internal surface of a leadframe, the recess pattern including a perimeter recess that defines aperimeter around one or more raised surfaces; placing component attachadhesive on the one or more raised surfaces; attaching a component tothe internal surface of the lead frame such that a single terminal ofthe component is attached to the one or more raised surfaces and thesingle terminal covers the perimeter recess, wherein the perimeterrecess has a size and shape such that the recess is proximate aperimeter of the single terminal; and applying molding compound on thelead frame and around the component.

Example 18 includes the method of Example 17, wherein the one or moreraised surfaces comprise a single surface making up the entire areainternal to the perimeter recess.

Example 19 includes the method of any of Examples 17 or 18, whereinetching the recess pattern comprises etching one or more cross-recessesinternal to the perimeter recess, such that the one or more raisedsurfaces include multiple raised surfaces.

Example 20 includes the method of any of Examples 17-19, wherein theperimeter recess has a shape of a perimeter of a rectangle.

What is claimed is:
 1. A method of manufacturing a device, the methodcomprising: etching at least one recess pattern in an internal surfaceof a lead frame, the at least one recess pattern including a perimeterrecess that defines a perimeter of a mounting area; placing componentattach adhesive on one or more raised surfaces in the mounting area; andattaching a component to the internal surface of the lead frame suchthat a single terminal of the component is attached in the mounting areaand the single terminal covers the perimeter recess, wherein theperimeter recess has a size and shape such that the recess is proximatea perimeter of the single terminal, wherein the perimeter recess definesa continuous outer wall to impede flow of the component attach adhesive.2. The method of claim 1, wherein the single terminal of the componentcomprises an electrically conductive pad on the component.
 3. The methodof claim 1, comprising: attaching one or more other components to theinternal surface of the lead frame outside of the mounting area.
 4. Themethod of claim 1, wherein the perimeter recess has a shape of aperimeter of a rectangle.
 5. The method of claim 1, wherein the mountingarea comprises a single raised surface.
 6. The method of claim 1,wherein etching the at least one recess pattern comprises etching one ormore cross-recesses extending across the mounting area, thereby dividingthe mounting area into multiple raised surfaces.
 7. The method of claim1, wherein the one or more cross-recesses terminate on each end byconnecting with the perimeter recess.
 8. The method of claim 1,comprising: applying molding compound on the lead frame and around thecomponent.
 9. A method of manufacturing a device, the method comprising:etching a recess pattern in an internal surface of a lead frame, therecess pattern including a perimeter recess that defines a perimeteraround one or more raised surfaces; placing component attach adhesive onthe one or more raised surfaces; attaching a component to the internalsurface of the lead frame such that a single terminal of the componentis attached to the one or more raised surfaces and the single terminalcovers the perimeter recess, wherein the perimeter recess has a size andshape such that the recess is proximate a perimeter of the singleterminal, wherein the perimeter recess provides space into which thecomponent attach adhesive can expand; and applying molding compound onthe lead frame and around the component.
 10. The method of claim 9,wherein the one or more raised surfaces comprise a single surface makingup the entire area internal to the perimeter recess.
 11. The method ofclaim 9, wherein etching the recess pattern comprises etching one ormore cross-recesses internal to the perimeter recess, such that the oneor more raised surfaces include multiple raised surfaces.
 12. The methodof claim 9, wherein the perimeter recess has a shape of a perimeter of arectangle.